Electronics technician or precision mechanic

The research team is involved in the CMS experiment at the European research center CERN, which became famous for the discovery of the Higgs boson. In particular, the team is playing a leading role in the construction of the new CMS tracking detector and has committed itself to building and testing 500 silicon pixel sensor modules over the next three years.
Are you interested in being part of this exciting environment?


As part of this project, you will support the module production and development of the tools and methods as a technician. You will be responsible for the following tasks:

  • the focus of the work will be semi-automatic fine pitch wire bonding on a wedge bonder from F&S Bondtec; each of the pixel modules has four readout chips, for each of which approx. 200 wires have to be placed in order to connect the chips electrically to a special thin readout board
  • optical, microscope-supported initial testing of the detector components supplied by industrial partners and their recording in a database
  • precisely gluing the modules using a commercial robotic arm, which was purchased and customized specifically for this project
  • support with electrical tests as part of quality control
  • recording all work steps and the measurement data generated in the process in a database

In addition to the above-mentioned activities, you will also design new mechanical devices as required, which are needed for measurement series in the project. The components required for this are then manufactured from various materials in the on-site mechanical workshop and will be assembled by you.


  • completed training as an electronics technician or precision mechanic; further education as a technician (“Technikerausbildung”) is desired, but not a prerequisite


  • equivalent skills, experience, and qualifications

Verification of equivalent skills, experience, and qualifications for the last prerequisites will be conducted on hiring.

Required skills and personal qualities

  • very good knowledge of electronics or precision mechanics
  • very good knowledge of fine wire bonding or the willingness to acquire this as part of the familiarization with the project and, if necessary, further training
  • good knowledge of using CAD (e.g. 3-D Solid Edge, AutoCad, Autodesk Inventor)
  • ability to communicate with the members of the working group
  • knowledge of English is desirable, as the working group is very internationally oriented
  • ability to work independently
  • ability to work in a team and good communication skills
  • sense of responsibility
  • ability and willingness to continue training and deal with new technologies

We offer

Reliable remuneration based on wage agreements
Continuing education opportunities
University pensions
Attractive location
Flexible working hours
Work-life balance opportunities
Health management

Employee laptops

Mobile work

Educational leave

30 days of vacation per annum

Universität Hamburg—University of Excellence is one of the strongest research educational institutions in Germany. Our work in research, teaching, educational and knowledge exchange activities is fostering the next generation of responsible global citizens ready to tackle the global challenges facing us. Our guiding principle “Innovating and Cooperating for a Sustainable Future” drives collaboration with academic and nonacademic partner institutions in the Hamburg Metropolitan Region and around the world. We would like to invite you to be part of our community to work with us in creating sustainable and digital change for a dynamic and pluralist society.

We explicitly encourage persons with an immigrant background to apply.

Severely disabled and disabled applicants with the same status will receive preference over equally qualified non-disabled applicants.

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